Intermetallic fracture

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Categories: Terms

A flip chip solder joint tensile pull failure when the fracture surface occurs at an intermetallic formed between the solder and the device or substrate.

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About Fred Schenkelberg

I am the reliability expert at FMS Reliability, a reliability engineering and management consulting firm I founded in 2004. I left Hewlett Packard (HP)’s Reliability Team, where I helped create a culture of reliability across the corporation, to assist other organizations.

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