A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction

Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction

Greg and Tony talk to me about stencil design and how to reduce voiding. Voiding is a key concern in specific electronic applications including automotive and LED electronic manufacturing. Greg and Tony published a paper entitled “Root Cause Stencil Design for SMT Component Thermal Lands”
Download here: https://tinyurl.com/szx3xt8

Greg Smith can be reached here: gsmith@blueringstencils.com

Tony Lentz can be reached here: tlentz@fctassembly.com